- Part Number Configuration Voltage Clock Rate / Access time Package Temperature SCD#
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SRAM
大容量SRAM是高存儲密度的靜態(tài)數(shù)據(jù)存儲器，由一個或多個SRAM基片采用立體封裝工藝堆疊而成。廣泛應用于航空航天領域嵌入式計算機系統(tǒng)。
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產(chǎn)品特性 |
總?cè)萘浚?/span>4M~32M;
訪問速度：最快達15ns；
數(shù)據(jù)寬度：8位，16位，32位，40位；
電源電壓：3.3V，5V；
典型產(chǎn)品輻照指標：
TID: 100 krad（Si）
SEL: 99.8 Mev·cm2/mg
SEU: 0.7 Mev·cm2/mg
工作溫度：-55℃~125℃。
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產(chǎn)品列表 |
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# |
SRAM |
存儲容量（bit） |
存儲組織 |
電壓 |
訪問速度 |
抗輻射 |
封裝 |
溫度等級 |
篩選等級 |
質(zhì)量等級 |
||
|
TID 1) |
SEL 2) |
SEU 3) |
||||||||||
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1 |
4M |
512k*8 |
5V |
15 ns |
100 |
59 |
0.2 |
SOP44 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
|
|
2 |
VDSR4M08xS44xx1V12 |
4M |
512k*8 |
3.3V |
15 ns |
100 |
27 |
0.2 |
SOP44 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
|
3 |
8M |
512K*16 |
5V |
15 ns |
＞50 |
＞75 |
＞2 |
SOP54 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
|
|
4 |
8M |
512K*16 |
3.3V |
15 ns |
＞100 |
＞75 |
＞0.9 |
SOP54 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
|
|
5 |
8M |
256k*32 |
3.3V |
15 ns |
100 |
99.8 |
0.7 |
SOP64 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
|
|
6 |
VDSR16M08XS44XX4C12 |
16M |
2M*8 |
5V |
15 ns |
100 |
59 |
0.2 |
SOP44 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
|
7 |
16M |
1M*16 |
5V |
15 ns |
＞50 |
＞75 |
＞2 |
SOP54 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
|
|
8 |
16M |
1M*16 |
3.3V |
15 ns |
100 |
＞81.4 |
＜8.94 |
SOP54 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
|
|
9 |
16M |
512k*32 |
5V |
15 ns |
＞50 |
＞75 |
＞2 |
SOP64 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
|
|
10 |
16M |
512k*32 |
3.3V |
15 ns |
100 |
＞76.5 |
＞1.7 |
SOP64 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
|
|
11 |
VDSR20M40xS84xx2V12 |
20M |
512k*40 |
3.3V |
15 ns |
＞100 |
＞75 |
＞0.9 |
SOP84 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
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12 |
20M |
512k*40 |
3.3V |
15 ns |
＞100 |
＞75 |
＞0.9 |
SOP84 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
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|
13 |
32M |
1M*32 |
3.3V |
15 ns |
＞100 |
＞75 |
＞0.9 |
SOP68 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
|
|
14 |
32M |
1M*32 |
3.3V |
15 ns |
＞100 |
＞75 |
＞0.9 |
SOP68 |
E,I,M |
E,B,M,S |
EE, IB, MM, MS |
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1)、TID: Total Dose（Krads(Si)）
2)、SEL: LET Threshold（Mev.cm2/mg）
3)、SEU:SEU Threshold （Mev.cm2/mg）
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相關下載 |
|
VDSR4M08xS44xx1C12 user manual.pdf |
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VDSR4M08xS44xx1V12 user manual.pdf |
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VDSR8M16xS54xx2C12 user manual.pdf |
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VDSR8M16xS54xx2V12 user manual.pdf |
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VDSR8M32xS64xx2V12 user manual.pdf |
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VDSR16M08XS44XX4C12 user manual.pdf |
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VDSR16M16xS54xx4C12 user manual.pdf |
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VDSR16M16xS54xx4V12 user manual.pdf |
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VDSR16M32xS64xx4C12 user manual.pdf |
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VDSR16M32xS64xx4V12 user manual.pdf |
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VDSR20M40xS84xx2V12 user manual.pdf |
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VDSR20M40xS84xx6V12 user manual.pdf |
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VDSR32M32xS68xx8V12 user manual.pdf |
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VDSR32M32xS68xx8V12-Ⅱ user manual.pdf |
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立體封裝模塊焊接后清洗建議.pdf |
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立體封裝模塊加固建議.pdf |
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立體封裝模塊手工裝配工藝建議.pdf |
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立體封裝模塊自動回流焊裝配規(guī)范.pdf |
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- Part Number Configuration Voltage Clock Rate / Access time Package Temperature SCD#
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- Part Number Configuration Voltage Clock Rate / Access time Package Temperature SCD#
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- Part Number Configuration Voltage Clock Rate / Access time Package Temperature SCD#
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